Design for Integrated Planar Spiral Inductor for MEMS

The main aim of this paper is to present the new design an integrated planar spiral inductor with a structure underpass obtain high inductance, quality factor and minimum losses into winding magnetic core. performance dependent on geometrical, electrical parameters material properties. These are calculated at 350 MHz frequency used for MEMS applications. Furthermore, thermal analysis in from finite difference method described. heat transfer model based conduction convection. Moreover, source by different losses. In addition, simulation results 3D element using software also been presented paper. It both classical equation certain condition limits. However, has proposed where via fabricated circular layer. input output implanted same direction. core solution decrease temperature. Finally, compared method. good agreement between obtained. responsible enhancement behavior inductor. result shows that temperature air could be 53 °C 33 °C, respectively.